Veenstra H Circuit and Interconnect Design for RF App 2008

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[b]Veenstra H Circuit and Interconnect Design for RF App 2008 | 7.51 MB[/b]
[b]N/A | 256 Pages[/b]
[b]Title:[/b] Circuit and Interconnect Design for RF and High Bit-rate Applications
[b]Author:[/b] Hugo Veenstra, John R. Long
[b]Year:[/b] N/A

[b]Description:[/b]
DIMENSIONS: This suit case measures 21.47" x 13.59" x 10.44 inches and is perfect for all kinds of traveling. This bag is made from E.V.A , Polyester, Aluminum and Polypropylene.

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