bookbestseller Posted March 8 Report Share Posted March 8 Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah , Yehea Ismail , Alaa El-RoubyEnglish | PDF (True) | 2015 | 181 Pages | ISBN : 3319076108 | 11.7 MBThis book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.[/b]RapidGatorhttps://rg.to/file/d37c563b0b33f685e587af34e3140905/al277.7z.htmlTakeFilehttps://takefile.link/qi21nd5kmvqz/al277.7z.htmlFileaxahttps://fileaxa.com/k7vvjxlb0j0s/al277.7zFikperhttps://fikper.com/fTQTuXWthW/al277.7z.html Link to comment Share on other sites More sharing options...
Recommended Posts
Please sign in to comment
You will be able to leave a comment after signing in
Sign In Now